1. Planarization design of circuit graphics: logic design, circuit conversion, circuit division, layout design, plane component design, discrete component selection, consideration of parasitic effect at high frequency, consideration of thermal performance at high power, and consideration of noise at small signal.
2. Production of printing screen: the graphic design is made on stainless steel or nylon screen by developing method.
3. Selection of circuit substrate and slurry: 96% of alumina ceramic substrate (other substrates can be selected for special circuits) is usually selected for making thick film hybrid integrated circuits. The slurry is generally selected from the conduction band, dielectric, electrical resistance and other slurry of DuPont, Electronic Laboratory and Tanaka.
4. Screen printing: use a printing machine to print various pastes on the substrate through the screen that has produced circuit graphics.
5. High temperature sintering: the printed substrate is sintered in a high temperature sintering furnace to form a good fusion and network interconnection between the slurry and the substrate, and to stabilize the resistance of the thick film resistor.
6. Laser resistance adjustment: use a thick film laser resistance adjustment machine to adjust the printed thick film resistance value on the sintered circuit substrate to the specified requirements.
7. Surface mounting: use the automatic mounting machine to assemble various externally mounted components and connectors on the circuit substrate, and complete the welding through the reflow soldering furnace, including the welding of outgoing lines.
8. Circuit test: test various functions and performance parameters of the welded circuit on the test bench.
Post time: Feb-06-2023