Ceramic substrates (alumina, aluminum nitride, silicon nitride, zirconia, zirconia toughened alumina, ZTA, etc.) have been widely used in high-tech fields such as semiconductor chip packaging, sensors, communication electronics, mobile phones and other intelligent terminals, instruments and meters, new energy, new light sources, automobile high-speed rail, wind power generation, robotics, aerospace, defense and military industry, due to their excellent thermal, mechanical, chemical and dielectric properties. According to statistics, the market of various ceramic substrates prepared by tape-casting process has reached tens of billions every year. Especially in recent years, with the rapid development of China’s new energy vehicles, high-speed rail and 5G base stations, the power device IGBT used in these new industries has a huge demand for silicon nitride and aluminum nitride ceramic substrates with high thermal conductivity and high strength, and the annual demand of CRRC alone has reached 5 million pieces; Alumina ceramic substrate is not only widely used in the electronic and electrical industry, but also has more and more new applications in the field of pressure sensors and LED heat dissipation.
According to statistics, alumina ceramic capacitive pressure sensors are used in a large amount in various vehicles, with a market of nearly 10 billion yuan. However, at present, almost all of the alumina ceramic plates used are imported. Zirconia ceramic substrates have not only important applications in new energy solid fuel cells, but also become an important material for smart phone fingerprint identification plates and mobile phone backplanes in the past two years, and have been applied in mobile phones of brands such as Xiaomi and OPPO, In 2017, the shipment of ceramic backplates for mobile phones has exceeded 500000 pieces.
In the huge industrial chain of ceramic substrate, there are not only huge business opportunities and market demands, but also many key technical and technological issues, as well as cooperation and docking between the upstream and downstream of the industrial chain. It mainly includes ceramic powder of high-performance substrate, advanced tape casting process, tape casting equipment and slurry, different sintering technology of oxide and nitride substrate, substrate leveling and processing technology, substrate metallization and copper coating process, and detection and evaluation of materials and products.
Five application fields
1. IGBT modules for high-speed rail, new energy vehicles, wind power generation, robots, 5G base stations
2. Smartphone backplane and fingerprint identification
3. New generation solid fuel cell
4. New flat pressure sensor and oxygen sensor
5. LD/LED heat dissipation, laser system, hybrid integrated circuit
Post time: Feb-06-2023